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MMUN2130LT1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
MMUN2130LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
MMUN2130LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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MMUN2130LT1G Details

  • Manufacturer Part Number:

    MMUN2130LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    3

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.4 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MMUN2130LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use a solid ground plane, and keep the device away from high-current paths. A thermal pad on the bottom of the package should be connected to a thermal relief pattern on the PCB. A heat sink or thermal interface material can be used to further improve heat dissipation.
  • The device requires a stable input voltage (VCC) and a proper biasing network to ensure optimal performance. A recommended biasing circuit is shown in the application note, which includes a voltage regulator, resistors, and capacitors. The device should be operated within the recommended operating conditions and biasing levels.
  • The device has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. Use an ESD wrist strap or mat, handle the device by the package body, and avoid touching the pins. Store the device in an anti-static bag or container.
  • Yes, the MMUN2130LT1G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is designed to operate in harsh environments. However, it's essential to follow the recommended operating conditions, and ensure the device is properly derated for the specific application.
  • Common issues include overheating, output voltage deviations, or oscillations. Troubleshooting steps include checking the PCB layout, biasing network, and input voltage. Verify that the device is operated within the recommended conditions, and check for any signs of physical damage or contamination.

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MMUN2130LT1G Overview

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