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MP2625BGL-Z - Monolithic Power Systems (MPS)

Description: 2A Switching Charger with NVDC Power Path Management For Single Cell Li+ Battery

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PCB Footprints
MP2625BGL-Z - Monolithic Power Systems (MPS) PCB footprint - Other - Other - MP2625BGL-Z-3
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3D Models
MP2625BGL-Z - Monolithic Power Systems (MPS)  - 3D model - Other - MP2625BGL-Z-3
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MP2625BGL-Z Details

  • Manufacturer Part Number:

    MP2625BGL-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-20

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    6.26

  • Additional Feature:

    it aslo has 4v threshold

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC22,.16X.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.05 mm

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +3.95V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MP2625BGL-Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the MP2625BGL-Z should prioritize thermal dissipation. Place the IC near a thermal pad or a heat sink, and ensure a clear path for heat to escape. Use a 2-layer or 4-layer board with a solid ground plane to reduce thermal resistance. Avoid routing high-current traces near the IC to minimize thermal coupling.
  • To optimize output voltage accuracy, ensure the input voltage is within the recommended range (4.5V to 18V). Use a high-precision voltage reference (e.g., 0.5% or better) and a low-ESR output capacitor (e.g., X5R or X7R). Additionally, minimize noise and ripple on the input voltage and ensure good PCB layout practices.
  • The maximum safe operating temperature for the MP2625BGL-Z is 125°C (TJ). However, it's recommended to keep the junction temperature (TJ) below 115°C for optimal reliability and performance. Ensure proper thermal design and heat dissipation to maintain a safe operating temperature.
  • Yes, the MP2625BGL-Z is suitable for high-reliability and automotive applications. It meets the AEC-Q100 standard for automotive-grade ICs and is designed for high-reliability applications. However, ensure you follow the recommended operating conditions, PCB layout, and thermal design guidelines to ensure optimal performance and reliability.
  • To troubleshoot issues with the MP2625BGL-Z, start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, thermal design, and component selection. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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MP2625BGL-Z Overview

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