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MP2672GD-0000-Z - Monolithic Power Systems (MPS)

Description: Battery Management Boost Charger with Cell Balance for 2-Cell Series Lithium-Ion Battery

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MP2672GD-0000-Z - Monolithic Power Systems (MPS) PCB footprint - Other - Other - MP2672GD-0000-Z-2
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3D Models
MP2672GD-0000-Z - Monolithic Power Systems (MPS)  - 3D model - Other - MP2672GD-0000-Z-2
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MP2672GD-0000-Z Details

  • Manufacturer Part Number:

    MP2672GD-0000-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-18

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2020-02-28

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    6.25

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-XQCC-N18

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC18,.08X.12,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.75 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +6V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

MP2672GD-0000-Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the MP2672GD-0000-Z should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good airflow around the component. Use a 2-3 layer PCB with a solid ground plane to reduce thermal resistance. Keep the input and output capacitors close to the device to minimize parasitic inductance.
  • To optimize output voltage accuracy, ensure the feedback resistors (R1 and R2) have a 1% tolerance or better. Use a high-precision voltage reference, and consider adding a capacitor (e.g., 10nF) in parallel with R2 to filter out noise. Additionally, minimize the distance between the feedback pin and the output capacitor to reduce noise coupling.
  • For the MP2672GD-0000-Z, use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7μF to 10μF. This will help filter out input noise and ensure stable operation. Avoid using electrolytic capacitors, as they may not provide sufficient filtering.
  • The MP2672GD-0000-Z has a built-in thermal shutdown feature that activates when the junction temperature exceeds 150°C. To handle this, ensure good airflow around the device, and consider adding a heat sink or thermal pad. If thermal shutdown occurs, the device will automatically restart once the junction temperature drops below 120°C.
  • For the MP2672GD-0000-Z, use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 10μF to 22μF. This will help filter out output noise and ensure stable operation. Avoid using electrolytic capacitors, as they may not provide sufficient filtering.

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MP2672GD-0000-Z Overview

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