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MP8007HGV-Z - Monolithic Power Systems (MPS)

Description: FULLY-INTEGRATED 802.3AF-COMPATIBLE POE PD INTERFACE WITH 13W FLYBACK OR BUCK CONVERTER - Tape and Reel

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PCB Footprints
MP8007HGV-Z - Monolithic Power Systems (MPS) PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN28 (4mmX5mm)_1
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3D Models
MP8007HGV-Z - Monolithic Power Systems (MPS)  - 3D model - Quad Flat No-Lead - QFN28 (4mmX5mm)_1
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MP8007HGV-Z Details

  • Manufacturer Part Number:

    MP8007HGV-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-28

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    7.5

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER OVER ETHERNET

  • JESD-30 Code:

    R-XQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    57 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +12.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MP8007HGV-Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the MP8007HGV-Z should prioritize thermal management, with a solid ground plane and thermal vias to dissipate heat. Keep the input and output capacitors close to the IC, and use a star topology for the power traces to minimize noise and EMI.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, add a 10nF-100nF capacitor in parallel with the output capacitor to improve stability and reduce oscillations.
  • Although the datasheet specifies a maximum input voltage of 18V, it's recommended to limit the input voltage to 15V to ensure reliable operation and prevent damage to the IC.
  • The output voltage ripple and noise can be calculated using the formula: ΔVout = (Iout * Rl) / (fsw * Cout), where Iout is the output current, Rl is the inductor resistance, fsw is the switching frequency, and Cout is the output capacitance.
  • The recommended inductor value is 1.5μH-3.3μH, with a saturation current rating of at least 2A. A shielded inductor with a low DCR (e.g., 10-20mΩ) is recommended to minimize losses and EMI.

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