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MPF100T-FCG484I - Microchip

Description: PolarFire™ Field Programmable Gate Array (FPGA) IC 244 7782400 109000 484-BBGA, FCBGA

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MPF100T-FCG484I - Microchip - PCB symbol
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PCB Footprints
MPF100T-FCG484I - Microchip PCB footprint - BGA - BGA - FCG484
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3D Models
MPF100T-FCG484I - Microchip - 3D model - BGA - FCG484
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MPF100T-FCG484I Details

  • Manufacturer Part Number:

    MPF100T-FCG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • Pin Count:

    484

  • Manufacturer Package Code:

    BGA-484

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of Inputs:

    244

  • Number of Outputs:

    244

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.87 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

MPF100T-FCG484I Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane through multiple thermal vias.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Use a multi-layer PCB with a solid ground plane, and ensure that all high-frequency signals are routed away from the device. Also, consider using EMI filters and shielding to minimize radiation.
  • Use the device's power-down modes, and optimize the clock frequency and voltage to minimize power consumption. Also, consider using a power management IC to optimize power consumption.
  • Use a reflow soldering process, and ensure that the PCB is designed to minimize thermal stress. Also, consider using a solder mask to prevent bridging and ensure reliable connections.

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MPF100T-FCG484I Overview

Use the download button to access the MPF100T-FCG484I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MPF10, or try a keyword search, such as Field Programmable Gate Arrays

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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