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MPF300T-1FCG784NI - Microchip

Description: PolarFire™ Field Programmable Gate Array (FPGA) IC 388 21600666 300000 784-BBGA, FCBGA

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MPF300T-1FCG784NI Details

  • Manufacturer Part Number:

    MPF300T-1FCG784NI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    784

  • Manufacturer Package Code:

    BGA-784

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    22

  • Additional Feature:

    IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B784

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    388

  • Number of Logic Cells:

    300000

  • Number of Outputs:

    388

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA784,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.47 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

MPF300T-1FCG784NI Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout for the MPF300T-1FCG784NI in the 'PCB Layout Guidelines' section of the datasheet. However, for optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions and thermal management guidelines. This includes keeping the junction temperature (Tj) below the maximum rating of 125°C, using a heat sink if necessary, and ensuring good airflow around the device.
  • The internal oscillator of the MPF300T-1FCG784NI has a limited frequency range and accuracy. If a higher frequency or better accuracy is required, an external clock source should be used. Additionally, if the device is operating in a noisy environment, an external clock source may be necessary to ensure reliable operation.
  • The MPF300T-1FCG784NI has built-in POR and BOD circuits. To implement POR, connect the POR pin to a capacitor and a resistor to create a power-on reset circuit. For BOD, connect the BOD pin to a capacitor and a resistor to set the brown-out detection threshold. Refer to the datasheet for specific implementation details.
  • To minimize EMI and ensure EMC, follow good design practices such as using a solid ground plane, keeping signal traces short and away from the edge of the PCB, and using shielding and filtering components as necessary. Additionally, ensure that the device is operated within its specified frequency range and that clock signals are not routed near sensitive analog circuits.

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MPF300T-1FCG784NI Overview

Use the download button to access the MPF300T-1FCG784NI 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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