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MPF300T-FCG484I - Microsemi Corporation

Description: FPGA PolarFire Family 300000 Cells 28nm Technology 484-Pin FBGA Tray

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PCB Footprints
MPF300T-FCG484I - Microsemi Corporation PCB footprint - BGA - BGA - FC484 23X23
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3D Models
MPF300T-FCG484I - Microsemi Corporation  - 3D model - BGA - FC484 23X23
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MPF300T-FCG484I Details

  • Manufacturer Part Number:

    MPF300T-FCG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    BGA-484

  • HTS Code:

    8542.31.00.60

  • Date Of Intro:

    2019-12-05

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    IT ALSO OPERATES AT 1.05 V NOM SUPPLY

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.87 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

MPF300T-FCG484I Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use the Microsemi Libero SoC software to generate a bitstream and configure the FPGA. Ensure that the configuration clock is stable and within the recommended frequency range.
  • The core voltage (VCC) should be powered up before the auxiliary voltage (VCCAUX). The power-on reset (POR) signal should be asserted after the power supplies have stabilized.
  • Use a dedicated JTAG interface chip, such as the Microsemi JTAG HS2, and ensure that the JTAG clock frequency is within the recommended range (typically 10-30 MHz).
  • The built-in PLLs have limited frequency range and jitter tolerance. For high-speed applications, consider using an external clock source or a dedicated PLL chip.

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