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MPF500TS-FCG784T2 - Microchip

Description: PolarFire™ Field Programmable Gate Array (FPGA) IC 388 33792000 481000 784-BBGA, FCBGA

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MPF500TS-FCG784T2 - Microchip PCB footprint - BGA - BGA - FCG784
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MPF500TS-FCG784T2 Details

  • Manufacturer Part Number:

    MPF500TS-FCG784T2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-784

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • Additional Feature:

    IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B784

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    388

  • Number of Logic Cells:

    481000

  • Number of Outputs:

    388

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA784,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.41 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

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MPF500TS-FCG784T2 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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