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MPF5024AMMA0ES - NXP

Description: Power Management Specialized - PMIC Power Management IC, pre-prog, 4 step-down DC/DC, QM Safety

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MPF5024AMMA0ES - NXP - PCB symbol
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PCB Footprints
MPF5024AMMA0ES - NXP PCB footprint - Other - Other - MPF5024AMMA0ES-2
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MPF5024AMMA0ES - NXP - 3D model - Other - MPF5024AMMA0ES-2
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MPF5024AMMA0ES Details

  • Manufacturer Part Number:

    MPF5024AMMA0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2020-04-15

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    40

MPF5024AMMA0ES Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency components (e.g., L1, C1, and R1) close to the IC, and use short, direct traces to minimize parasitic inductance.
  • Monitor the input voltage, output voltage, and output current to ensure they are within the recommended operating ranges. Also, ensure the device is operated within the recommended temperature range (-40°C to 125°C).
  • The critical components that affect the MPF5024AMMA0ES's performance are the input capacitor (Cin), output capacitor (Cout), and the inductor (L1). These components should be selected based on the application's requirements and the device's operating conditions.
  • Use an oscilloscope to monitor the input and output voltages, and check for any signs of oscillation or instability. Verify that the input voltage is within the recommended range, and check for any short circuits or open circuits in the PCB.
  • The MPF5024AMMA0ES has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer between the IC and the PCB.

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MPF5024AMMA0ES Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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