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MPF7100BMBA0ES - NXP

Description: Power Management Specialised - PMIC Power management IC, i.MX 8, i.MX 6, S32, non-prog, 5 buck, 2 LDO, Auto, ASIL B, grade 1, QFN 48 Voltage - Supply 2.5V ~ 5.5V,Temperature-40°C ~ 125°C (TA)

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PCB Footprints
MPF7100BMBA0ES - NXP PCB footprint - Other - Other - SOT619-27(D)_2025-3
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3D Models
MPF7100BMBA0ES - NXP  - 3D model - Other - SOT619-27(D)_2025-3
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MPF7100BMBA0ES Details

  • Manufacturer Part Number:

    MPF7100BMBA0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-48

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2020-08-25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    7

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.8V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MPF7100BMBA0ES Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Keep the layout compact, use a solid ground plane, and minimize signal trace lengths. Use shielding and filtering components as needed. Follow the recommended layout guidelines in the application note.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
  • Use a heat sink with a thermal interface material, ensure good airflow, and follow the recommended thermal design guidelines. Derate the device's power dissipation according to the temperature derating curve.
  • Power up the device in the following sequence: VCC, then VBAT, then EN. Ensure a minimum of 10 ms delay between each power-up step.

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MPF7100BMBA0ES Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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