Part Image

MPFS095T-FCVG784I - Microchip

Description: RISC-V System On Chip (SOC) IC PolarFire® FPGA - 93K Logic Modules 784-BGA

Download MPFS095T-FCVG784I Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MPFS095T-FCVG784I - Microchip PCB footprint - BGA - BGA - FCVG784
click to zoom
3D Models
MPFS095T-FCVG784I - Microchip  - 3D model - BGA - FCVG784
click to zoom

MPFS095T-FCVG784I Details

  • Manufacturer Part Number:

    MPFS095T-FCVG784I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-784

  • Pin Count:

    784

  • Manufacturer Package Code:

    BGA-784

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    ALSO OPERATES AT 1.05V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B784

  • Length:

    23 mm

  • Number of Inputs:

    412

  • Number of Logic Cells:

    93000

  • Number of Outputs:

    412

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    BGA784,28X28,32

  • Package Shape:

    SQUARE

  • Packing Method:

    TRAY

  • Programmable Logic Type:

    FPGA SOC

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

MPFS095T-FCVG784I Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to ensure good heat dissipation. Additionally, keeping the PCB traces as short as possible and using a thermal pad under the package can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device temperature within the recommended range.
  • The input capacitor (Cin) should be a low-ESR ceramic capacitor with a value between 1-10uF, and the output capacitor (Cout) should be a low-ESR ceramic capacitor with a value between 10-22uF. The capacitors should be placed as close as possible to the device pins to minimize parasitic inductance and ensure stable operation.
  • To troubleshoot issues with the power-good (PG) signal, check the voltage levels on the PG pin, ensure that the input voltage is within the recommended range, and verify that the output voltage is within the specified tolerance. Also, check for any noise or oscillations on the PG pin, and ensure that the PG pin is properly terminated with a pull-up resistor.
  • If the enable (EN) pin is not used, the device will always be in an enabled state, which can lead to increased power consumption and heat generation. It's recommended to use the EN pin to control the device's power state, especially in battery-powered applications where power management is critical.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MPFS095T-FCVG784I Overview

Use the download button to access the MPFS095T-FCVG784I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MPFS0, or try a keyword search, such as Field Programmable Gate Arrays

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

Parts related to MPFS095T-FCVG784I

Showing 0 results