MR25H10MDF - Everspin Technologies

MR25H10MDF Details

• Manufacturer Part Number:

  MR25H10MDF

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  SON

• Package Description:

  DFN-8

• Pin Count:

  8

• Country Of Origin:

  Philippines, Taiwan

• ECCN Code:

  EAR99

• Manufacturer:

  Everspin Technologies

• YTEOL:

  5

• Clock Frequency-Max (fCLK):

  40 MHz

• JESD-30 Code:

  R-PDSO-N8

• JESD-609 Code:

  e3

• Length:

  6 mm

• Memory Density:

  1048576 bit

• Memory IC Type:

  MRAM

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  131072 words

• Number of Words Code:

  128000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  128KX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVSON

• Package Equivalence Code:

  SOLCC8,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  0.9 mm

• Serial Bus Type:

  SPI

• Standby Current-Max:

  0.000115 A

• Standby Voltage-Min:

  3 V

• Supply Current-Max:

  0.027 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  3 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  5 mm

• Write Protection:

  HARDWARE/SOFTWARE