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MR25H256ACDFR - Everspin Technologies

Description: MRAM 256Kb 3.3V 32Kx8 SPI

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PCB Footprints
MR25H256ACDFR - Everspin Technologies PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN-8**
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3D Models
MR25H256ACDFR - Everspin Technologies  - 3D model - Small Outline No-lead - DFN-8**
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MR25H256ACDFR Details

  • Manufacturer Part Number:

    MR25H256ACDFR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Everspin Technologies

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    MRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    5 mm

MR25H256ACDFR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MR25H256ACDFR is -40°C to 85°C.
  • To ensure data integrity during power cycling, it is recommended to use a voltage supervisor or a power-on reset circuit to ensure that the device is properly initialized before accessing the memory.
  • The recommended storage condition for the MR25H256ACDFR is in a dry, cool place, away from direct sunlight, with a relative humidity of 60% or less, and at a temperature range of -40°C to 30°C.
  • The MR25H256ACDFR is not designed to operate in radiation-intensive environments. If you need a radiation-hardened device, you should consider a different product.
  • In the event of a write error, the device will set the Write Enable Latch (WEL) bit in the Status Register. The host should retry the write operation after resetting the WEL bit.

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