MR25H256MDF - Everspin Technologies

MR25H256MDF Details

• Manufacturer Part Number:

  MR25H256MDF

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Part Package Code:

  SON

• Package Description:

  DFN-8

• Pin Count:

  8

• Country Of Origin:

  Philippines, Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.71

• Manufacturer:

  Everspin Technologies

• YTEOL:

  3

• JESD-30 Code:

  R-PDSO-N8

• JESD-609 Code:

  e3

• Length:

  6 mm

• Memory Density:

  262144 bit

• Memory IC Type:

  MEMORY CIRCUIT

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  32768 words

• Number of Words Code:

  32000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  32KX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVSON

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  0.9 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  3 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  5 mm