HALOGEN FREE AND ROHS COMPLIANT, CASE 419-04, SC-70, 3 PIN
Pin Count:
3
Manufacturer Package Code:
318
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Manufacturer:
onsemi
YTEOL:
7
Collector Current-Max (IC):
0.15 A
Collector-Emitter Voltage-Max:
300 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
40
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
0.45 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
AMPLIFIER
Transistor Element Material:
SILICON
MSD42T1G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal sink or heat spreader.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal design, and consider derating the device's power dissipation. Additionally, onsemi provides a thermal model that can be used to simulate the device's thermal behavior.
The recommended soldering conditions for the MSD42T1G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering temperature profile that follows the IPC J-STD-020D standard.
To handle ESD protection for the MSD42T1G, it's recommended to follow proper ESD handling procedures, use ESD-protected workstations, and consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to the circuit design.
The limited availability of spare gates in the MSD42T1G may impact the device's ability to tolerate faults or implement redundancy. Engineers should carefully plan their design to minimize the need for spare gates and consider using alternative devices or design approaches if spare gates are essential.
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System Verified
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MSD42T1G Overview
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