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MSP430F2131IDGV - Texas Instruments

Description: 16-Bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, Comparator

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MSP430F2131IDGV - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G20)
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MSP430F2131IDGV - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G20)
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MSP430F2131IDGV Details

  • Manufacturer Part Number:

    MSP430F2131IDGV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    NO

  • Additional Feature:

    ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of I/O Lines:

    16

  • Number of Terminals:

    20

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • RAM (words):

    0.25

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    16 MHz

  • Supply Current-Max:

    0.35 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F2131IDGV Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 16 MHz. However, it's recommended to use a clock frequency of up to 12 MHz for optimal performance and to ensure that the device operates within its specified parameters.
  • To configure the MSP430F2131IDGV for low-power operation, you can use the Power Management Module (PMM) to control the power modes. The PMM allows you to select from several power modes, including Active, Low Power, and Shutdown. You can also use the Clock System (CS) module to control the clock frequency and disable unused peripherals to reduce power consumption.
  • The maximum current that can be sourced or sunk by the GPIO pins is 4 mA. However, it's recommended to limit the current to 2 mA or less to ensure that the device operates within its specified parameters and to prevent overheating.
  • To use the USCI module for UART communication, you need to configure the module for UART mode, select the desired baud rate, and enable the transmitter and receiver. You can then use the USCI module to transmit and receive data using the UART protocol.
  • The JTAG interface is a debugging interface that allows you to connect a debugger or emulator to the device for debugging and testing purposes. You can use the JTAG interface to access the device's memory, registers, and peripherals, and to set breakpoints and inspect variables.

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MSP430F2131IDGV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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