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MSP430F2131IDGVR - Texas Instruments

Description: MCU 16-bit MSP430 MSP430 RISC 8KB Flash 2.5V/3.3V 20-Pin TVSOP T/R

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MSP430F2131IDGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G)
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MSP430F2131IDGVR Details

  • Manufacturer Part Number:

    MSP430F2131IDGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    NO

  • Additional Feature:

    ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of I/O Lines:

    16

  • Number of Terminals:

    20

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • RAM (words):

    0.25

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    16 MHz

  • Supply Current-Max:

    0.41 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F2131IDGVR Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 16 MHz, but it's recommended to use 12 MHz or lower for optimal performance and to ensure that the device operates within its specified parameters.
  • To configure the MSP430F2131IDGVR for low-power operation, you can use the Power Management Module (PMM) to select the lowest possible clock frequency, disable unused peripherals, and use the Low Power Mode (LPM) feature. You can also use the Dynamic Voltage Scaling (DVS) feature to reduce the voltage supply to the core and peripherals.
  • The maximum current that can be sourced or sunk by the GPIO pins is 4 mA per pin, but it's recommended to limit the current to 2 mA per pin to ensure reliable operation and to prevent damage to the device.
  • The USCI module can be configured for UART, SPI, or I2C communication by setting the appropriate control registers and using the corresponding protocol-specific registers. You can refer to the MSP430F2131IDGVR user's guide and the TI-provided example code for more information.
  • The JTAG pins are used for debugging and programming the device using the Joint Test Action Group (JTAG) interface. You can use a JTAG debugger, such as the TI XDS100v2, to connect to the device and perform debugging operations, such as single-stepping, breakpoints, and register examination.

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MSP430F2131IDGVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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