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MSP430F5222IRGZR - Texas Instruments

Description: 16-bit Microcontrollers - MCU Mixed Signal MCU

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MSP430F5222IRGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ (S-PVQFN-N48)
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MSP430F5222IRGZR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ (S-PVQFN-N48)
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MSP430F5222IRGZR Details

  • Manufacturer Part Number:

    MSP430F5222IRGZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    48

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 1.8V AT 8MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    37

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    48

  • Number of Timers:

    18

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • RAM (words):

    8

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F5222IRGZR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MSP430F5222IRGZR is -40°C to 85°C, as specified in the datasheet. However, it's recommended to operate the device within the recommended operating temperature range of -40°C to 70°C for optimal performance and reliability.
  • To configure the MSP430F5222IRGZR for low-power operation, you can use the Power Management Module (PMM) to control the power modes. You can also use the Low Power Mode (LPM) to reduce power consumption. Additionally, you can disable unused peripherals and use the clock system to reduce power consumption. Refer to the datasheet and the MSP430F5222IRGZR user's guide for more information.
  • The maximum clock frequency for the MSP430F5222IRGZR is 16 MHz, as specified in the datasheet. However, the device can also operate at lower clock frequencies to reduce power consumption.
  • The MSP430F5222IRGZR can be programmed using the Texas Instruments Code Composer Studio (CCS) integrated development environment (IDE) or the IAR Embedded Workbench. You can also use the MSP430F5222IRGZR's built-in bootloader to program the device using a serial interface.
  • The MSP430F5222IRGZR has 32 KB of flash memory, which can be used to store program code and data.

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MSP430F5222IRGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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