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MSP430F5513IRGCR - Texas Instruments

Description: 25 MHz MCU with Integrated USB Phy, 32KB Flash, 4KB RAM, 32BIT HW Multiplier

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PCB Footprints
MSP430F5513IRGCR - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
MSP430F5513IRGCR - Texas Instruments  - 3D model - Other - QFN50P900X900X100-65N
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MSP430F5513IRGCR Details

  • Manufacturer Part Number:

    MSP430F5513IRGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    VQFN-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    47

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    64

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • RAM (words):

    4

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

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MSP430F5513IRGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image MSP430F5513IRGC Texas Instruments

RISC Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQCC64