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MSPM0L1105TRHBR - Texas Instruments

Description: Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 32 MHz • Operating characteristics – Extended temperature: –40°C to 105°C – Wide supply voltage range: 1.62 V to 3.6 V • Memories – Up to 64KB of flash – 4KB of SRAM • High-performance analog peripherals – One 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channels – Configurable 1.4-V or 2.5-V internal ADC voltage reference (VREF) – One general-purpose amplifier (GPAMP) – Integrated temperature sensor • Op

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PCB Footprints
MSPM0L1105TRHBR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - VQFN 33
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3D Models
MSPM0L1105TRHBR - Texas Instruments  - 3D model - Quad Flat No-Lead - VQFN 33
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MSPM0L1105TRHBR Details

  • Manufacturer Part Number:

    MSPM0L1105TRHBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    24

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    32

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4096

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSPM0L1105TRHBR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the MSPM0L1105TRHBR datasheet, but it's also recommended to follow the general guidelines for PCB layout for power modules, such as keeping the high-current paths short and wide, and using a solid ground plane to reduce EMI.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, including the maximum junction temperature (TJ) of 150°C. Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device temperature within the recommended range.
  • Possible causes of overheating in the MSPM0L1105TRHBR include high ambient temperature, high output current, poor PCB layout, and inadequate thermal management. To prevent overheating, ensure proper thermal management, follow the recommended operating conditions, and monitor the device temperature using the built-in thermal protection feature.
  • To troubleshoot issues with the MSPM0L1105TRHBR, start by reviewing the datasheet and application notes to ensure that the device is used within the recommended operating conditions. Then, use oscilloscopes and other diagnostic tools to identify the root cause of the issue, and consult with Texas Instruments' technical support if necessary.
  • Yes, the MSPM0L1105TRHBR can be used in a parallel configuration to increase the output current, but it's essential to follow the recommended guidelines for paralleling power modules, including ensuring that the devices are identical, using a common input voltage, and providing adequate thermal management.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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