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MT40A1G16RC-062E:B - Micron

Description: DRAM DDR4 16G 1GX16 FBGA

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PCB Footprints
MT40A1G16RC-062E:B - Micron PCB footprint - BGA - BGA - 96-Ball FBGA – x16 (RC)
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MT40A1G16RC-062E:B - Micron  - 3D model - BGA - 96-Ball FBGA – x16 (RC)
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MT40A1G16RC-062E:B Details

  • Manufacturer Part Number:

    MT40A1G16RC-062E:B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    1600 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B96

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Memory Density:

    17179869184 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    1GX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.081 A

  • Standby Voltage-Min:

    1.14 V

  • Supply Current-Max:

    0.268 mA

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

MT40A1G16RC-062E:B Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT40A1G16RC-062E:B is 0°C to 85°C.
  • To ensure signal integrity on the address and command bus, use a controlled impedance PCB design, keep the signal traces short, and use a termination scheme such as ODT (On-Die Termination) or a discrete terminator.
  • The recommended voltage for the VDD and VDDQ power supplies is 1.2V ± 0.06V.
  • During self-refresh mode, the DRAM module will automatically refresh the memory array. No external refresh commands are required.
  • The maximum clock frequency supported by the MT40A1G16RC-062E:B is 1600MHz.

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MT40A1G16RC-062E:B Overview

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