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MT40A4G8NEA-062E:F - Micron

Description: DRAM DDR4 32G 4GX8 FBGA DDP

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MT40A4G8NEA-062E:F Details

  • Manufacturer Part Number:

    MT40A4G8NEA-062E:F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-78

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    5.4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Clock Frequency-Max (fCLK):

    1600 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B78

  • Length:

    11 mm

  • Memory Density:

    34359738368 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    78

  • Number of Words:

    4294967296 words

  • Number of Words Code:

    4000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    4GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA78,9X11,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Current-Max:

    0.205 mA

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Bismuth/Copper (Sn/Ag/Bi/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

MT40A4G8NEA-062E:F Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for this module is 0°C to 85°C.
  • To ensure signal integrity, use a signal integrity analysis tool to optimize the PCB design, and consider using a signal integrity model for the module. Additionally, follow the recommended routing guidelines and layout considerations outlined in the datasheet.
  • The recommended refresh rate for this module is 4x refresh per tREFI (32ms) at 85°C, and 2x refresh per tREFI (64ms) at 70°C.
  • The ZQ calibration process is an internal process that occurs during power-up and reset. No external intervention is required. The module will automatically perform the ZQ calibration process during power-up and reset.
  • The maximum number of modules that can be stacked together depends on the system design and the specific application. However, as a general guideline, it is recommended to limit the number of stacked modules to 4 or less to ensure signal integrity and to prevent overheating.

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MT40A4G8NEA-062E:F Overview

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