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MT41K256M16TW-093:P - Micron

Description: DRAM DRAM DDR3 V00H 4Gb

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MT41K256M16TW-093:P - Micron PCB footprint - BGA - BGA - 96-Ball FBGA – x16 (TW)(1.2)
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MT41K256M16TW-093:P - Micron  - 3D model - BGA - 96-Ball FBGA – x16 (TW)(1.2)
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MT41K256M16TW-093:P Details

  • Manufacturer Part Number:

    MT41K256M16TW-093:P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-96

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    7

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

  • JESD-30 Code:

    R-PBGA-B96

  • JESD-609 Code:

    e1

  • Length:

    14 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR3L DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    256MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.45 V

  • Supply Voltage-Min (Vsup):

    1.283 V

  • Supply Voltage-Nom (Vsup):

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

MT41K256M16TW-093:P Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for this module is 0°C to 95°C, with a storage temperature range of -40°C to 100°C.
  • To ensure signal integrity on the address and command bus, it is recommended to use a controlled impedance PCB design, keep the signal traces short and matched, and use a termination scheme such as ODT (On-Die Termination) or series termination.
  • The recommended refresh rate for this module is 4K refresh cycles every 64ms, with a refresh interval of 7.8us.
  • No, this module is designed to operate at a voltage supply of 1.2V, and using it with a different voltage supply may damage the module or affect its performance.
  • It is recommended to implement error detection and correction mechanisms, such as ECC (Error-Correcting Code) or CRC (Cyclic Redundancy Check), to detect and correct errors. Retries can be implemented using a retry counter and a timeout mechanism.

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