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MT47H256M8EB-25E:C - Micron

Description: DRAM DDR2 2G 256MX8 FBGA

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PCB Footprints
MT47H256M8EB-25E:C - Micron PCB footprint - BGA - BGA - 60-Ball FBGA Package (9mm x 11.5mm) – x4, x8
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3D Models
MT47H256M8EB-25E:C - Micron  - 3D model - BGA - 60-Ball FBGA Package (9mm x 11.5mm) – x4, x8
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MT47H256M8EB-25E:C Details

  • Manufacturer Part Number:

    MT47H256M8EB-25E:C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    BGA

  • Package Description:

    9 X 11.50 MM, ROHS COMPLIANT, FBGA-60

  • Pin Count:

    60

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    1

MT47H256M8EB-25E:C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for this module is 0°C to 85°C.
  • To ensure signal integrity, use a signal integrity analysis tool to simulate the signal behavior and optimize the PCB design. Additionally, use a clock signal with a high slew rate and a low jitter to minimize signal degradation.
  • The recommended voltage for the VDD and VDDQ power supplies is 1.5V ± 0.075V.
  • The MT47H256M8EB-25E:C module requires a refresh command every 64ms. The refresh command should be sent to the module during the self-refresh mode to maintain data integrity.
  • The maximum current consumption of this module is 1.5A during operation and 100mA during standby.

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MT47H256M8EB-25E:C Overview

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Part Image MT47H256M8EB-25EIT:C Micron Technology Inc

DDR2 DRAM, 256MX8, 0.4ns, CMOS, PBGA60

Part Image MT47H256M8EB-25EIT:A Micron Technology Inc

DDR2 DRAM, 256MX8, 0.4ns, CMOS, PBGA60

Part Image MT47H256M8EB-25EAIT:C Micron Technology Inc

DDR2 DRAM, 256MX8, 0.4ns, CMOS, PBGA60