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MT60B2G8RZ-72BAAT:H - Micron

Description: VDD = VDDQ = 1.1V (NOM) • VPP= 1.8V (NOM) • On-die, internal, adjustable VREF generation for DQ, CA, CS • 1.1V pseudo open-drain I/O • TC maximum up to 95°C – 32ms, 8192-cycle refresh up to 85°C – 16ms, 8192-cycle refresh at >85°C to 95°C • 32 internal banks (x4, x8): 8 groups of 4 banks each • 16 internal banks (x16): 4 groups of 4 banks each • 16n-bit prefetch architecture • 1 cycle/2 cycle command structure

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MT60B2G8RZ-72BAAT:H - Micron PCB footprint - BGA - BGA - 78-ball 7.5mma x 11.0m..m FBGAs
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3D Models
MT60B2G8RZ-72BAAT:H - Micron  - 3D model - BGA - 78-ball 7.5mma x 11.0m..m FBGAs
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