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MT62F2G32D8DR-031WT:B - Micron

Description: DRAM LPDDR5 64G 2GX32 FBGA 8DP, 3.2GHz, 1.01V, 32bit, -25C to +85C

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MT62F2G32D8DR-031WT:B - Micron PCB footprint - BGA - BGA - 315-Ball TFBGA
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MT62F2G32D8DR-031WT:B - Micron  - 3D model - BGA - 315-Ball TFBGA
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MT62F2G32D8DR-031WT:B Details

  • Manufacturer Part Number:

    MT62F2G32D8DR-031WT:B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TFBGA-315

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    3195 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    16,32

  • JESD-30 Code:

    R-PBGA-B315

  • Length:

    15 mm

  • Memory Density:

    68719476736 bit

  • Memory IC Type:

    LPDDR5 DRAM

  • Memory Width:

    32

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    315

  • Number of Words:

    2147483648 words

  • Number of Words Code:

    2000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Organization:

    2GX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA315,15X21,32/28

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    16,32

  • Supply Current-Max:

    0.36 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    12.4 mm

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MT62F2G32D8DR-031WT:B Overview

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