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MVMBF0201NLT1G - onsemi

Description: Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Miniature SOT-23 Surface Mount Package Saves Board Space; RoHS Compliant; Qualified to AEC Q101; PPAP Capable

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MVMBF0201NLT1G - onsemi - PCB symbol
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PCB Footprints
MVMBF0201NLT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
MVMBF0201NLT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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MVMBF0201NLT1G Details

  • Manufacturer Part Number:

    MVMBF0201NLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.3 A

  • Drain-source On Resistance-Max:

    1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MVMBF0201NLT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND9093/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid exceeding the maximum junction temperature (Tj) of 175°C.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input/output pins to protect against electrostatic discharge. Follow the onsemi ESD protection guidelines for more information.
  • Yes, the MVMBF0201NLT1G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is PPAP capable. Contact onsemi for more information on the qualification process.
  • Use a soldering temperature of 260°C (max) for 10 seconds (max) to avoid damaging the device. Follow the onsemi soldering guidelines for more information.

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MVMBF0201NLT1G Overview

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