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MVR5510AMBA4ES - NXP

Description: Power Management Specialized - PMIC Safety power management IC, QFN56

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PCB Footprints
MVR5510AMBA4ES - NXP PCB footprint - Other - Other -  SOT684-21(DDSC)
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3D Models
MVR5510AMBA4ES - NXP  - 3D model - Other -  SOT684-21(DDSC)
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MVR5510AMBA4ES Details

  • Manufacturer Part Number:

    MVR5510AMBA4ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    QFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    60 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +7.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MVR5510AMBA4ES Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a voltage rating of 10V or higher. Place them as close to the device as possible.
  • Use a shielded enclosure, keep sensitive components away from the device, and ensure good grounding and decoupling. Implement EMI filters and shielding if necessary.
  • Follow the JEDEC J-STD-020D.1 standard for reflow soldering. Peak temperature should not exceed 260°C, and the total process time should be less than 3 minutes.

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MVR5510AMBA4ES Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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