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MVR5510AMDA0ES - NXP

Description: Power Management Specialised - PMIC Safety power management IC, QFN56 60 V - 40 C+ 125 C 2.7 V to 60 V

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Symbol
MVR5510AMDA0ES - NXP - PCB symbol
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PCB Footprints
MVR5510AMDA0ES - NXP PCB footprint - Other - Other - SOT684-21(DD/SC)_2026-2.2
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3D Models
MVR5510AMDA0ES - NXP - 3D model - Other - SOT684-21(DD/SC)_2026-2.2
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MVR5510AMDA0ES Details

  • Manufacturer Part Number:

    MVR5510AMDA0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    QFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    60 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +7.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MVR5510AMDA0ES Frequently Asked Questions (FAQs)

  • NXP recommends a 4-layer PCB with a solid ground plane and thermal vias to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the top layer.
  • NXP recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Ensure proper heat sink attachment and consider using a thermal pad or thermal tape for improved thermal conductivity.
  • NXP recommends using 100 nF and 10 μF decoupling capacitors, placed as close as possible to the device's power pins. The capacitors should be rated for the operating voltage and have a low ESR (Equivalent Series Resistance).
  • NXP recommends using ESD-protective packaging, wrist straps, and mats during handling and assembly. Ensure that all equipment and tools are properly grounded, and consider using an ESD-protected workstation.
  • NXP recommends a peak reflow temperature of 260°C, with a maximum time above 217°C of 60 seconds. The recommended soldering profile is a ramp-soak-ramp profile with a peak temperature of 260°C and a total process time of 3-4 minutes.

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MVR5510AMDA0ES Overview

Use the download button to access the MVR5510AMDA0ES schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MVR55, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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