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NB3L553DG - onsemi

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Symbol
NB3L553DG - onsemi - PCB symbol
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PCB Footprints
NB3L553DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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3D Models
NB3L553DG - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NB3L553DG Details

  • Manufacturer Part Number:

    NB3L553DG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V OR 5V SUPPLY

  • Family:

    3L

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.035 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    85 mA

  • Prop. Delay@Nom-Sup:

    5 ns

  • Propagation Delay (tpd):

    5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    200 MHz

NB3L553DG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3L553DG involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing the decoupling capacitors close to the device. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and power-down of the NB3L553DG, it's recommended to follow a controlled power-up sequence, where the input voltage is ramped up slowly (typically 1-2 ms) to prevent inrush currents. During power-down, the input voltage should be ramped down slowly as well to prevent damage to the device.
  • The NB3L553DG has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the bottom of the package helps to dissipate heat, and a thermal interface material can be used to improve heat transfer.
  • To minimize EMI with the NB3L553DG, it's recommended to use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the input and output lines. Additionally, a good PCB layout and proper grounding can help reduce EMI emissions.
  • The NB3L553DG is manufactured by onsemi, which adheres to strict quality and reliability standards, including ISO 9001 and AEC-Q100. The device is also qualified for automotive and industrial applications, ensuring high reliability and performance over a wide temperature range.

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NB3L553DG Overview

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NB3L553DG Alternates

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Part Image ICS553MILF Renesas Electronics Corporation

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Part Image ICS553MIT Integrated Device Technology Inc

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Part Image 553MIT Integrated Device Technology Inc

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For a full list of alternate parts for NB3L553DG, check out Findchips.com