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NB3N51044DTG - onsemi

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NB3N51044DTG - onsemi - PCB symbol
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NB3N51044DTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP28 CASE 948AA
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NB3N51044DTG - onsemi - 3D model - Small Outline Packages - TSSOP28 CASE 948AA
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NB3N51044DTG Details

  • Manufacturer Part Number:

    NB3N51044DTG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP-28

  • Manufacturer Package Code:

    948AA

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Clock Frequency-Max:

    125 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    25 MHz

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    126 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, PROCESSOR SPECIFIC

NB3N51044DTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3N51044DTG should consider the following: keep the input and output traces short and symmetrical, use a solid ground plane, and place decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, follow these guidelines: use a stable voltage source, decouple the input and output pins with capacitors, and ensure the input voltage is within the recommended range (2.7V to 5.5V). Additionally, use a pull-up or pull-down resistor on the enable pin (EN) to prevent floating.
  • The NB3N51044DTG can handle a maximum continuous current of 1A per channel. However, it's essential to consider the power dissipation and thermal management to prevent overheating. Use a heat sink or a thermally enhanced package to ensure reliable operation.
  • To protect the NB3N51044DTG from ESD and overvoltage, use external protection devices such as TVS diodes or ESD protection arrays. Additionally, ensure the PCB design includes a robust ESD protection scheme, and follow proper handling and storage procedures to prevent ESD damage.
  • The NB3N51044DTG is rated for operation from -40°C to 125°C. However, it's essential to consider the derating of the device's performance and reliability at extreme temperatures. Ensure proper thermal management and consider the device's power dissipation when operating at high temperatures.

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NB3N51044DTG Overview

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