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NB3N551DR2G - onsemi

Description: ON SEMICONDUCTOR - NB3N551DR2G - Fanout Buffer, 180 MHz, 3 V to 5.5 V, 4 Outputs, SOIC-8

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NB3N551DR2G Details

  • Manufacturer Part Number:

    NB3N551DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    3N

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.025 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    95 mA

  • Prop. Delay@Nom-Sup:

    6 ns

  • Propagation Delay (tpd):

    3 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.16 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    180 MHz

NB3N551DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3N551DR2G involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, ensure that the output capacitor is within the recommended range, the input voltage is within the specified range, and the device is operated within the recommended temperature range. Additionally, a minimum ESR of 0.1 ohms is recommended for the output capacitor.
  • The NB3N551DR2G can operate in ambient temperatures up to 105°C, but the junction temperature should not exceed 150°C. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • Yes, the NB3N551DR2G is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is essential to follow proper design and manufacturing guidelines to ensure the device operates within its specifications.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, decoupling, and thermal design. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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Part Image NB3N551DG onsemi

Low Skew Clock Driver, 3N Series, 4 True Output(s), 0 Inverted Output(s), PDSO8