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NB3V8312CFAG - onsemi

Description: VDD core supply voltage can be set to 3.3 V, 2.5 V or 1.8 V; VDDO output supply voltage can be set to 3.3 V, 2.5 V, or 1.8 V, with the constraint that VDD >/= VDDO; 250 MHz Maximum Clock Frequency; Accepts LVCMOS, LVTTL Clock Inputs; 12 LVCMOS Clock Outputs; 150 ps Max. Skew Between Outputs; Temp. Range 40C to +85C; 32pin LQFP and QFN Packages; Synchronous Clock Enable

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NB3V8312CFAG - onsemi - PCB symbol
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NB3V8312CFAG - onsemi PCB footprint - Quad Flat Packages - Quad Flat Packages - 32 LEAD LQFP CASE 873A−02 ISSUE C
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NB3V8312CFAG - onsemi - 3D model - Quad Flat Packages - 32 LEAD LQFP CASE 873A−02 ISSUE C
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NB3V8312CFAG Details

  • Manufacturer Part Number:

    NB3V8312CFAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    32 LEAD LQFP 7x7, 0.8P

  • Package Description:

    LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    561AB

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Additional Feature:

    ALSO OPERATES AT 2.5V, 3.3V SUPPLY VOLTAGE

  • Family:

    NB3V

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    4.2 ns

  • Same Edge Skew-Max (tskwd):

    0.15 ns

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • fmax-Min:

    250 MHz

NB3V8312CFAG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3V8312CFAG involves keeping the input and output traces short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and power-down of the NB3V8312CFAG, it's recommended to follow a controlled power-up sequence, where the input voltage is ramped up slowly (e.g., 10-20 ms) to prevent inrush currents. During power-down, the input voltage should be ramped down slowly as well.
  • The NB3V8312CFAG has a thermal junction-to-ambient resistance of 45°C/W. To ensure reliable operation, it's recommended to keep the device junction temperature below 125°C. This can be achieved by using a heat sink, improving air flow, or reducing the power dissipation.
  • To troubleshoot issues with the NB3V8312CFAG, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly powered up and that the input voltage is within the recommended range. Check for any signs of overheating, and ensure that the PCB layout is correct.
  • Yes, the NB3V8312CFAG is a high-frequency device and can be susceptible to electromagnetic interference (EMI). To minimize EMI, use a shielded enclosure, keep the device away from other high-frequency components, and use EMI filters or shielding on the input and output lines.

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NB3V8312CFAG Overview

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