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NCN4555MNR2G - onsemi

Description: Supports 1.8V or 3.0V Operating SIM Card; The LDO is able to supply more than 50mA under 1.8V and 3.0V; Built-in pullup resistor for I/O pin in both directions.; All pins are fully ESD protected according to ISO-7816 Specifications - ESD Protection on SIM pins in excess of 7kV (Human Body Model); Supports more than 5MHz clock

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PCB Footprints
NCN4555MNR2G - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN16 3x3x0.75m
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NCN4555MNR2G - onsemi  - 3D model - Quad Flat No-Lead - QFN16 3x3x0.75m
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NCN4555MNR2G Details

  • Manufacturer Part Number:

    NCN4555MNR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN16 3*3*0.75 MM, 0.5 P

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    488AK

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    INTERNAL LDO REQUIRES VBAT 2.7 TO 5.5 V

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NCN4555MNR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature (TJ) and adjust the design accordingly.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
  • Yes, but ensure the device is properly heatsinked and the current is within the recommended operating range. Excessive current can lead to overheating and reduced lifespan.
  • Check the EN pin voltage, ensure the input voltage is within the recommended range, and verify the device is properly connected to the load. Consult the datasheet and application notes for further guidance.

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NCN4555MNR2G Overview

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Part Image NCN4555MN onsemi

Power Supply Support Circuit, Fixed, 1 Channel, QCC16