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NCP1090DG - onsemi

Description: Fully supports IEEE 802.3af specifications - Allows for up to 15W of power - Certified interoperability between PoE devices; 500 mA operational current limit; Industrial temperature range -40°C to 85°C with full operation up to 125°C junction temperature; Vertical N-Channel DMOS pass switch offers the robustness of discrete MOSFETs

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NCP1090DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 CASE 751AZ ISSUE B
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NCP1090DG - onsemi  - 3D model - Small Outline Packages - SOIC−8 CASE 751AZ ISSUE B
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NCP1090DG Details

  • Manufacturer Part Number:

    NCP1090DG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751AZ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    PoE POWERED DEVICE CONTROLLERS

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9276 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7272 mm

  • Supply Current-Max (Isup):

    0.9 mA

  • Supply Voltage-Max (Vsup):

    57 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +31V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.937 mm

NCP1090DG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the NCP1090DG is to keep the input and output capacitors close to the device, and to use a solid ground plane to reduce EMI. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. The datasheet provides a recommended PCB layout, but it's also recommended to consult with onsemi's application notes and layout guidelines for more detailed information.
  • To ensure the NCP1090DG is stable and doesn't oscillate, it's essential to follow the recommended component values and PCB layout. Additionally, the input and output capacitors should be selected to ensure that the device operates within its stable region. The datasheet provides guidance on component selection and stability analysis. It's also recommended to perform a stability analysis using simulation tools such as SPICE or PSpice.
  • The maximum output current of the NCP1090DG is 1A, but it's limited by the thermal performance of the device and the PCB. The device can deliver up to 1A of output current, but it's recommended to derate the output current based on the ambient temperature and the thermal performance of the system. The datasheet provides thermal performance data and derating curves to help determine the maximum output current.
  • The NCP1090DG is rated for operation up to 125°C, but it's essential to consider the thermal performance of the device and the system when operating in high-temperature environments. The device's thermal performance can be affected by the PCB layout, thermal vias, and heat sinks. It's recommended to perform thermal analysis and simulation to ensure the device operates within its thermal limits.
  • To troubleshoot issues with the NCP1090DG, it's essential to follow a systematic approach. First, verify that the device is properly powered and that the input and output voltages are within the recommended range. Next, check the PCB layout and component values to ensure they match the recommended values. Use oscilloscopes and other measurement tools to verify the device's operation and identify any anomalies. Consult the datasheet and application notes for troubleshooting guidelines and common issues.

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