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NCP1096PAR2G - onsemi

Description: IEEE 802.3bt, IEEE 802.3at, IEEE 802.3af compliant - Allows for up to 90 W of power - Guaranteed interoperability between PoE devices; Part of ON Semiconductor’s family of high efficiency solutions for PoE-PD; Features an internal 71 mΩ pass transistor to support high-power applications; 5-Event Physical Layer Classification; Smart power budgeting using Autoclass support which allows the PSE to assign power to each PD efficiently; Active bridge and hot-swap FET disable when Auxililary supply connected, incr

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NCP1096PAR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP 16 4.4*5
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NCP1096PAR2G - onsemi  - 3D model - Small Outline Packages - TSSOP 16 4.4*5
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NCP1096PAR2G Details

  • Manufacturer Part Number:

    NCP1096PAR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-16 EP

  • Package Description:

    TSSOP-16

  • Manufacturer Package Code:

    948BV

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    39 Weeks

  • Date Of Intro:

    2018-10-26

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    PoE POWERED DEVICE CONTROLLER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    57 V

  • Supply Voltage-Nom (Vsup):

    12.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

NCP1096PAR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1096PAR2G should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces under the device, and keep the thermal pad connected to a solid ground plane.
  • To ensure reliable startup and shutdown, ensure that the input voltage rises and falls monotonically, and that the enable pin (EN) is properly driven. A soft-start circuit can also be implemented to limit inrush current during startup.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10-22uF is recommended for the input capacitor. This helps to filter out input voltage noise and reduce the risk of oscillation.
  • To minimize ripple and noise, use a low-ESR output capacitor (e.g., ceramic or polymer) with a value of 10-47uF. Add a small series resistor (e.g., 1-10 ohms) to dampen the output filter and reduce ringing.
  • The NCP1096PAR2G can withstand input voltage transients up to 30V for a duration of 100ms, as specified in the datasheet. However, it's recommended to limit transients to 25V or less to ensure reliable operation.

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