Description:135mW to a 16 load from a 5.0V power supply; Excellent PSRR (85dB Typical); Pop & Click noise protection circuit; Ultra Low Current Shutdown Mode; 2.2V - 5.5V Operation; Superior THD+N: Less than 0.01%; External Turn-on and Turn-off configuration capability; Ultra Thin MicroDFN-10 (3x3x0.55mm); Pb-Free Package is Available
A good PCB layout for the NCP2809BDMR2G should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2oz copper thickness is recommended.
To ensure reliable start-up, ensure that the input voltage is within the specified range, the output capacitor is properly sized, and the feedback network is correctly configured. Additionally, a soft-start circuit can be implemented to reduce inrush current and prevent voltage overshoot.
When selecting the output inductor and capacitor values, consider the desired output voltage ripple, inductor core saturation, and capacitor ESR. A good starting point is to use the values recommended in the datasheet, and then optimize based on specific application requirements.
To minimize EMI, use a shielded inductor, keep the switching node (SW) away from sensitive circuits, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure good PCB layout practices, such as separating analog and digital grounds, and using a solid ground plane.
Operating the NCP2809BDMR2G at high ambient temperatures can reduce its reliability and lifespan. Ensure that the device is properly heatsinked, and consider derating the output current and voltage to prevent overheating. Consult the datasheet for thermal derating guidelines.
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NCP2809BDMR2G Overview
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