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NCP300LSN25T1G - onsemi

Description: ON Semiconductor NCP300LSN25T1G, Voltage Detector, 0.9 → 4.9 V, 5-Pin TSOP

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Symbol
NCP300LSN25T1G - onsemi - PCB symbol
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PCB Footprints
NCP300LSN25T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP_5
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3D Models
NCP300LSN25T1G - onsemi - 3D model - SOT23 (5-Pin) - TSOP_5
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NCP300LSN25T1G Details

  • Manufacturer Part Number:

    NCP300LSN25T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0013 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCP300LSN25T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND8327/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Monitor the device's junction temperature (TJ) to prevent overheating.
  • The NCP300LSN25T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NCP300LSN25T1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • Check the input voltage, output voltage, and current draw. Verify that the device is properly configured and that the output capacitor is within the recommended range. Use an oscilloscope to monitor the output voltage and current waveforms.

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NCP300LSN25T1G Overview

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Part Image NCP300LSN25T1 onsemi

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