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NCP308MT300TBG - onsemi

Description: Wide Supply voltage range 1.6 to 5.5 V; Very low Quiescent Current 1.6 µV; Fixed threshold voltage version for Standard Voltage Rails; Adjustable threshold version available with low threshold (0.405 V min.) ; High Threshold Voltage Accuracy: 0.31% typical; Manual Reset Input (/MR) - Open Drain /RESET Output (Push Pull available upo request); Flexible Delay Time Programmability (1.25 ms up to 10 s)

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NCP308MT300TBG Details

  • Manufacturer Part Number:

    NCP308MT300TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN6, 2x2, 0.65P

  • Pin Count:

    6

  • Manufacturer Package Code:

    511BR

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8.75

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.006 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NCP308MT300TBG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a thermal interface material (TIM) between the device and the heat sink to minimize thermal resistance. Also, ensure good airflow around the device to prevent thermal hotspots.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a shielded inductor and place it as close to the device as possible. Ensure that the PCB layout is designed to minimize loop areas and reduce radiation. Additionally, use a common-mode choke and a ferrite bead to filter out high-frequency noise.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for output filtering. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.

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