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NCP308MTADJTBG - onsemi

Description: Supervisory Circuits Voltage Supervisor, Ultra Low Quiescent Current, Programmable Delay Time Low Quiescent Current, Pgmmable Delay Time Supervisory Ckt

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PCB Footprints
NCP308MTADJTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFN6 2x2, 0.65P CASE 511BR ISSUE C
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NCP308MTADJTBG - onsemi  - 3D model - Small Outline No-lead - WDFN6 2x2, 0.65P CASE 511BR ISSUE C
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NCP308MTADJTBG Details

  • Manufacturer Part Number:

    NCP308MTADJTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN6, 2x2, 0.65P

  • Pin Count:

    6

  • Manufacturer Package Code:

    511BR

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8.75

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.006 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +0.405V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NCP308MTADJTBG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP308MTADJTBG should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the thermal interface material is applied correctly. Also, follow the recommended derating guidelines for the device's power dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range.
  • While the NCP308MTADJTBG is not hermetically sealed, it can still be used in high-humidity environments with proper precautions. Ensure that the device is properly cleaned and dried before assembly, and consider applying a conformal coating to protect against moisture.
  • The NCP308MTADJTBG has built-in ESD protection, but it is still essential to follow proper ESD handling procedures during assembly and testing to prevent damage to the device.

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