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NCP367DPMUECTBG - onsemi

Description: ON SEMICONDUCTOR - NCP367DPMUECTBG - OVER VOLTAGE PROTECTOR, DFN-8

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PCB Footprints
NCP367DPMUECTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8, 2.0x2.2, 0.5P CASE 506BP−01 ISSUE A
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3D Models
NCP367DPMUECTBG - onsemi  - 3D model - Small Outline No-lead - DFN8, 2.0x2.2, 0.5P CASE 506BP−01 ISSUE A
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NCP367DPMUECTBG Details

  • Manufacturer Part Number:

    NCP367DPMUECTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN8 2.0x2.2, 0.5P

  • Package Description:

    -8

  • Pin Count:

    8

  • Manufacturer Package Code:

    506BP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR/PROTECTOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    2.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.13 mA

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NCP367DPMUECTBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for optimal performance and reliability.
  • Yes, the NCP367DPMUECTBG is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions and design guidelines.
  • Check the input voltage, output voltage, and current consumption. Verify that the device is properly soldered and that the PCB layout is correct. Also, check for any signs of physical damage or contamination.

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