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NCP398FCCT1G - onsemi

Description: Under-voltage Lockout (UVLO); Over-voltage Protection Up to + 28V; On-chip low Rdson NMOS transistors: Typical 190 mΩ; Over-voltage Lockout (OVLO); Shutdown ENB Input.; Output discharge path

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NCP398FCCT1G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.84x0.84x0.554 CASE 567MN ISSUE B..
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NCP398FCCT1G - onsemi  - 3D model - BGA - WLCSP4, 0.84x0.84x0.554 CASE 567MN ISSUE B..
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NCP398FCCT1G Details

  • Manufacturer Part Number:

    NCP398FCCT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567MN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.84 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFLGA

  • Package Equivalence Code:

    BGA4,2X2,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.066 mA

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.84 mm

NCP398FCCT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-3 layer PCB with a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a heat sink or thermal pad, and follow proper PCB design and layout guidelines.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure.
  • To protect the device from overvoltage and overcurrent conditions, use voltage regulators, current limiters, and fuses or circuit breakers to prevent excessive voltage and current from reaching the device.
  • The NCP398FCCT1G has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage to the device.

Trust Checks

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NCP398FCCT1G Overview

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