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NCP4545IMNTWG-L - onsemi

Description: ON Semiconductor NCP4545IMNTWG-L, 1-Channel Load Switch IC, Controlled Load Switch, 3 → 5.5V, 1.98W 18-Pin, QFN

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NCP4545IMNTWG-L - onsemi - PCB symbol
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PCB Footprints
NCP4545IMNTWG-L - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN18 3x3 0.5P CASE485BF IS
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3D Models
NCP4545IMNTWG-L - onsemi - 3D model - Quad Flat No-Lead - QFN18 3x3 0.5P CASE485BF IS
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NCP4545IMNTWG-L Details

  • Manufacturer Part Number:

    NCP4545IMNTWG-L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN18, 3x3, 0.5P

  • Package Description:

    QFN-18

  • Pin Count:

    18

  • Manufacturer Package Code:

    485BF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-XQCC-N18

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NCP4545IMNTWG-L Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND9093/D for more details.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VBIAS) to operate correctly. Ensure VIN is within the recommended range (4.5V to 18V) and VBIAS is set to 5V ± 10% for optimal performance.
  • The NCP4545IMNTWG-L can handle a maximum current of 5A. However, the actual current handling capability may be limited by the PCB design, thermal considerations, and other system-level factors.
  • Implement overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device. The OVP threshold should be set to 20V, and the UVP threshold should be set to 3.5V.
  • The device has an integrated ESD protection circuit, but additional external ESD protection is recommended to ensure robustness. A TVS diode or a transient voltage suppressor can be used to protect the device from ESD events.

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NCP4545IMNTWG-L Overview

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