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NCP45650IMNTWG - onsemi

Description: Power Switch ICs - Power Distribution ECOSWITCH NCP45650IMNTWG

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NCP45650IMNTWG Details

  • Manufacturer Part Number:

    NCP45650IMNTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DFN-12

  • Manufacturer Package Code:

    506DY

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    65 Weeks

  • Date Of Intro:

    2018-12-13

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    S-XDSO-N12

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max (Isup):

    1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    0.71

  • Width:

    3 mm

NCP45650IMNTWG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the copper traces wide and short can help reduce thermal resistance.
  • To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings, and provide a stable input voltage within the specified range. Additionally, ensure that the input and output capacitors are properly selected and placed close to the device to minimize parasitic inductance.
  • Key considerations for EMI filtering and noise reduction include using a pi-filter or LC filter at the input, placing the device away from noise sources, and using shielding or a metal can to reduce radiated emissions. Additionally, ensure that the PCB layout is designed to minimize loop areas and reduce radiation.
  • To handle overvoltage and undervoltage conditions, use a voltage supervisor or a voltage monitor to detect and respond to voltage faults. Additionally, consider using a voltage regulator with built-in overvoltage and undervoltage protection to ensure the device operates within the specified voltage range.
  • Thermal design considerations for high-power applications include using a heat sink or thermal interface material to improve heat transfer, ensuring good airflow around the device, and using a thermistor or temperature sensor to monitor the device temperature. Additionally, consider using a device with a higher power rating or a more efficient design to reduce heat generation.

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NCP45650IMNTWG Overview

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