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NCP45770IMN24TWG - onsemi

Description: Advanced Controller with Charge Pump; Soft-Start via Slew Rate Control; Ultra-Low On-Resistance; Input Voltage Range 2 V to 24 V (30V Tolerant); Low Standby Current; Quick Output Discharge Function; No External Components Required; Enable Pins with CMOS Input Levels; Power Good Signaling; Fault Protection: Over Temperature; Fault Protection: Under Voltage Lockout; Fault Protection: Short-Circuit Protection; Fault Protection: Over Current Protection; Pb-Free Device

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NCP45770IMN24TWG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN12 3x3, 0.5P(H=1mm)
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NCP45770IMN24TWG - onsemi  - 3D model - Small Outline No-lead - DFN12 3x3, 0.5P(H=1mm)
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NCP45770IMN24TWG Details

  • Manufacturer Part Number:

    NCP45770IMN24TWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-12

  • Manufacturer Package Code:

    506DY

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2018-12-12

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Analog IC - Other Type:

    Load switch

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

NCP45770IMN24TWG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its recommended operating temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • For EMI filtering and noise reduction, consider using a pi-filter or a common-mode choke in the input stage, and ensure that the PCB layout is designed to minimize noise coupling and radiation. Additionally, use shielding and grounding techniques to reduce electromagnetic interference.
  • To optimize output capacitor selection, consider the output voltage ripple, output current, and stability requirements. Choose a capacitor with a suitable capacitance value, ESR, and voltage rating. A general rule of thumb is to use a capacitor with a capacitance value of at least 10uF and an ESR of less than 100mΩ.
  • For input capacitor selection and placement, consider the input voltage range, input current, and noise sensitivity. Choose a capacitor with a suitable capacitance value, voltage rating, and ESR. Place the input capacitor close to the device's input pins and ensure that the PCB layout minimizes noise coupling and radiation.

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NCP45770IMN24TWG Overview

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