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NCP803SN308T1G - onsemi

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PCB Footprints
NCP803SN308T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
NCP803SN308T1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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NCP803SN308T1G Details

  • Manufacturer Part Number:

    NCP803SN308T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318-08

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.11 mm

  • Supply Current-Max (Isup):

    0.0025 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.08V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.3 mm

NCP803SN308T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the stability of the output voltage, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to use a sufficient output capacitor with a low ESR (Equivalent Series Resistance) and a suitable voltage rating.
  • Although the datasheet specifies a maximum input voltage of 18V, it's recommended to limit the input voltage to 15V to ensure reliable operation and to prevent damage to the device.
  • While ceramic capacitors can be used, they may not be the best choice due to their high ESR. A low-ESR electrolytic capacitor or a polymer capacitor is recommended for the output capacitor to ensure stability and low output voltage ripple.
  • To calculate the power dissipation, you need to consider the input voltage, output voltage, and output current. The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. Make sure to check the thermal derating curve in the datasheet to ensure the device operates within the safe operating area.

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