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- Part Number NCP803SN463D1T1G
- Manufacturer onsemi
- Pin Count 3
- Part Category Integrated Circuit
- Package Category SOT23 (3-Pin)
- Footprint Name SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
- Released Date Aug 20, 2015
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
NCP803SN463D1T1G Details
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Manufacturer Part Number:
NCP803SN463D1T1G
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Brand Name:
onsemi
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
SOT-23 (TO-236) 3 LEAD
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Package Description:
TO-236, SOT-23, 3 PIN
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Pin Count:
3
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Manufacturer Package Code:
318-08
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Country Of Origin:
Malaysia
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.60
NCP803SN463D1T1G Frequently Asked Questions (FAQs)
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For optimal thermal performance, it is recommended to have a solid copper plane under the device, and to use thermal vias to connect the plane to the thermal pad of the device. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal interface material (TIM) between the device and the heat sink can help to improve thermal performance.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink with a high thermal conductivity, and ensure good airflow around the device. It is also recommended to perform thermal simulations and testing to validate the design.
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Operating the device outside the recommended input voltage range may affect its performance, efficiency, and reliability. Using a lower input voltage may result in reduced output voltage and current capability, while using a higher input voltage may increase power losses and reduce the device's lifespan. It is recommended to consult with onsemi's application engineers for specific guidance on operating the device outside the recommended input voltage range.
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To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage, output load, and ambient temperature are within the recommended operating conditions. Check the output voltage using an oscilloscope or a multimeter, and ensure the output capacitor is properly sized and placed. If the issue persists, consult the datasheet and application notes for guidance on troubleshooting and debugging.
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To minimize EMI and EMC issues, it is recommended to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, ensure the device is properly decoupled, and consider using a common-mode choke or ferrite bead to reduce EMI emissions. Consult the datasheet and application notes for more detailed guidance on EMI and EMC considerations.
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NCP803SN463D1T1G Overview
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