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NCV303LSN11T1G - onsemi

Description: Active Low or Active High Reset; Quiescent Current of 0.5 uA Typical; High Accuracy Under Voltage Threshold of 2.0%; Wide Operating Voltage Range of 0.8 V to 10 V; Complementary or Open Drain Output; Externally Programmable Time Delay Generator; Pb-Free Packages are Available; NCV Version for Automotive

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PCB Footprints
NCV303LSN11T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 3.00x1.50x0.95, 0.95P CASE 483 ISSUE P
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3D Models
NCV303LSN11T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP−5 3.00x1.50x0.95, 0.95P CASE 483 ISSUE P
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NCV303LSN11T1G Details

  • Manufacturer Part Number:

    NCV303LSN11T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    8.21

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0012 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +1.1V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCV303LSN11T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The NCV303LSN11T1G has built-in ESD protection, but it's still recommended to follow proper ESD handling and storage procedures to prevent damage. A human body model (HBM) of 2 kV and a charged device model (CDM) of 1 kV are recommended.
  • Yes, the NCV303LSN11T1G is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to ensure that the device is used within its specified operating conditions and that the system design meets the required automotive standards and regulations.
  • The recommended soldering profile for the NCV303LSN11T1G involves a peak temperature of 260°C, a dwell time above 217°C of 30-60 seconds, and a total process time of 3-5 minutes. It's essential to follow the recommended soldering profile to prevent damage to the device.

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NCV303LSN11T1G Overview

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