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NCV303LSN25T1G - onsemi

Description: Active Low or Active High Reset; Quiescent Current of 0.5 uA Typical; High Accuracy Under Voltage Threshold of 2.0%; Wide Operating Voltage Range of 0.8 V to 10 V; Complementary or Open Drain Output; Externally Programmable Time Delay Generator; Pb-Free Packages are Available; NCV Version for Automotive

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PCB Footprints
NCV303LSN25T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 CASE  483 ISSUE N
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NCV303LSN25T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP−5 CASE  483 ISSUE N
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NCV303LSN25T1G Details

  • Manufacturer Part Number:

    NCV303LSN25T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    8.21

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0013 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCV303LSN25T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The NCV303LSN25T1G has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. A minimum of 1 kV human body model (HBM) and 250 V machine model (MM) ESD protection is recommended.
  • Yes, the NCV303LSN25T1G is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is recommended to follow the recommended operating conditions and to perform thorough testing and validation for the specific application.
  • The recommended soldering conditions are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 217°C or higher.

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NCV303LSN25T1G Overview

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