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NCV8406DD1CR2G - onsemi

Description: Thermal Shutdown with Automatic Restart; Over Voltage Protection; Integrated Clamp for Inductive Switching; ESD Protection; dV/dt Robustness; Analog Drive Capability (Logic Level Input); AEC-Q101 Qualified; This Device is Faster than the Rest of the NCV840x Devices; NCV Prefix for Automotive and Other Applications Requiring Site and Change Control; Self-Protected Low Side Driver

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NCV8406DD1CR2G - onsemi - PCB symbol
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PCB Footprints
NCV8406DD1CR2G - onsemi PCB footprint - Other - Other - SOIC−8 NB CASE 751−07 ISSUE AK
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NCV8406DD1CR2G - onsemi - 3D model - Other - SOIC−8 NB CASE 751−07 ISSUE AK
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NCV8406DD1CR2G Details

  • Manufacturer Part Number:

    NCV8406DD1CR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:10.5A

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q101

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV8406DD1CR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the device, and connecting it to a copper pour on the PCB layer. The copper pour should be connected to a ground plane or a heat sink to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure that the device is properly heatsinked and that the PCB is designed to handle high temperatures.
  • The recommended input capacitor value and type for this device is a 10uF to 22uF X7R or X5R ceramic capacitor with a voltage rating of 50V or higher. The capacitor should be placed as close as possible to the device.
  • To protect the device from input voltage transients and surges, it is recommended to use a TVS (Transient Voltage Suppressor) diode or a varistor in parallel with the input capacitor. This will help to clamp the input voltage and prevent damage to the device.
  • The recommended output capacitor value and type for this device is a 10uF to 22uF X7R or X5R ceramic capacitor with a voltage rating of 50V or higher. The output capacitor should be placed as close as possible to the output pin of the device.

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NCV8406DD1CR2G Overview

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